BYC8X-600P Hyperfast power diode 3 January 2014 Product data sheet 1. General description
Hyperfast power diode in a SOD113 (2-lead TO-220F) plastic package. 2. Features and benefits
• Reduces switching losses in associated MOSFET
3. Applications
• Continuous Current Mode (CCM) Power Factor Correction (PFC)
• Half-bridge/full-bridge switched-mode power supplies
4. Quick reference data Quick reference data Parameter Conditions Static characteristics VF Dynamic characteristics trr NXP Semiconductors BYC8X-600P Hyperfast power diode 5. Pinning information Pinning information Symbol Description Simplified outline Graphic symbol TO-220F (SOD113) 6. Ordering information Ordering information Type number Package Name Description
plastic single-ended package; isolated heatsink mounted; 1
mounting hole; 2-lead TO-220 "full pack"
7. Marking Marking codes Type number Marking code 8. Limiting values Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).Parameter Conditions
repetitive peak forward current δ = 0.5 ; tp = 25 µs; Th ≤ 75 °C; square-
All information provided in this document is subject to legal disclaimers. Product data sheet 3 January 2014 NXP Semiconductors BYC8X-600P Hyperfast power diode Parameter Conditions
tp = 8.3 ms; Tj(init) = 25 °C; sine-wave
Fig. 1. Forward power dissipation as a function of Fig. 2. Forward power dissipation as a function of average forward current; square waveform; average forward current; sinusoidal waveform; maximum values maximum values Fig. 3. Average forward current as a function of Fig. 4. Non-repetitive peak forward current as a heatsink temperature; maximum values function of pulse width; square waveform; maximum values
All information provided in this document is subject to legal disclaimers. Product data sheet 3 January 2014 NXP Semiconductors BYC8X-600P Hyperfast power diode 9. Thermal characteristics Thermal characteristics Parameter Conditions Fig. 5. Transient thermal impedance from junction to heatsink as a function of pulse width 10. Isolation characteristics Isolation characteristics Parameter Conditions
RMS isolation voltage 50 Hz ≤ f ≤ 60 Hz; RH ≤ 65 %; from all
pins to external heatsink; sinusoidalwaveform; clean and dust free
11. Characteristics Characteristics Parameter Conditions Static characteristics VF
All information provided in this document is subject to legal disclaimers. Product data sheet 3 January 2014 NXP Semiconductors BYC8X-600P Hyperfast power diode Parameter Conditions Dynamic characteristics Qr
IF = 8 A; VR = 200 V; dIF/dt = 200 A/µs;
Tj = 25 °C; IF = 8 A; VR = 200 V; dIF/dt = 200 A/µs;
Tj = 25 °C; IF = 8 A; VR = 400 V; dIF/dt = 500 A/µs;
peak reverse recovery IF = 8 A; VR = 200 V; dIF/dt = 200 A/µs;
Tj = 25 °C; IF = 8 A; VR = 200 V; dIF/dt = 200 A/µs;
Fig. 7. Reverse recovery definitions; ramp recovery Fig. 6. Forward current as a function of forward
All information provided in this document is subject to legal disclaimers. Product data sheet 3 January 2014 NXP Semiconductors BYC8X-600P Hyperfast power diode 12. Package outline Plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 2-lead TO-220 'full pack' DIMENSIONS (mm are the original dimensions) L1(1) max m
1. Terminals are uncontrol ed within zone L1. REFERENCES EUROPEAN PROJECTION ISSUE DATE Fig. 8. Package outline TO-220F (SOD113)
All information provided in this document is subject to legal disclaimers. Product data sheet 3 January 2014 NXP Semiconductors BYC8X-600P Hyperfast power diode
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation -
13. Legal information
lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
13.1 Data sheet status
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
Document Definition
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Development This document contains data from
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
Qualification This document contains data from the
notice. This document supersedes and replaces all information supplied prior
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
Please consult the most recently issued document before initiating or
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
The term 'short data sheet' is explained in section "Definitions".
applications and therefore such inclusion and/or use is at the customer’s own
The product status of device(s) described in this document may have
changed since this document was published and may differ in case of
multiple devices. The latest product status information is available on
Quick reference data — The Quick reference data is an extract of the
the Internet at URL http://www.nxp.com.
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding. 13.2 Definitions Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
Preview — The document is a preview version only. The document is still
specified use without further testing or modification.
subject to formal approval, which may result in modifications or additions.
NXP Semiconductors does not give any representations or warranties as to
Customers are responsible for the design and operation of their
the accuracy or completeness of information included herein and shall have
applications and products using NXP Semiconductors products, and NXP
no liability for the consequences of use of such information.
Semiconductors accepts no liability for any assistance with applications or
customer product design. It is customer’s sole responsibility to determine
Draft — The document is a draft version only. The content is still under
whether the NXP Semiconductors product is suitable and fit for the
internal review and subject to formal approval, which may result in
customer’s applications and products planned, as well as for the planned
modifications or additions. NXP Semiconductors does not give any
application and use of customer’s third party customer(s). Customers should
representations or warranties as to the accuracy or completeness of
provide appropriate design and operating safeguards to minimize the risks
information included herein and shall have no liability for the consequences
associated with their applications and products.
NXP Semiconductors does not accept any liability related to any default,
Short data sheet — A short data sheet is an extract from a full data sheet
damage, costs or problem which is based on any weakness or default
with the same product type number(s) and title. A short data sheet is
in the customer’s applications or products, or the application or use by
intended for quick reference only and should not be relied upon to contain
customer’s third party customer(s). Customer is responsible for doing all
detailed and full information. For detailed and full information see the
necessary testing for the customer’s applications and products using NXP
relevant full data sheet, which is available on request via the local NXP
Semiconductors products in order to avoid a default of the applications
Semiconductors sales office. In case of any inconsistency or conflict with the
and the products or of the application or use by customer’s third party
short data sheet, the full data sheet shall prevail.
customer(s). NXP does not accept any liability in this respect. Product specification — The information and data provided in a Product Limiting values — Stress above one or more limiting values (as defined in
data sheet shall define the specification of the product as agreed between
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
NXP Semiconductors and its customer, unless NXP Semiconductors and
damage to the device. Limiting values are stress ratings only and (proper)
customer have explicitly agreed otherwise in writing. In no event however,
operation of the device at these or any other conditions above those
shall an agreement be valid in which the NXP Semiconductors product
given in the Recommended operating conditions section (if present) or the
is deemed to offer functions and qualities beyond those described in the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device. 13.3 Disclaimers Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
Limited warranty and liability — Information in this document is believed
agreed in a valid written individual agreement. In case an individual
to be accurate and reliable. However, NXP Semiconductors does not give
agreement is concluded only the terms and conditions of the respective
any representations or warranties, expressed or implied, as to the accuracy
agreement shall apply. NXP Semiconductors hereby expressly objects to
or completeness of such information and shall have no liability for the
applying the customer’s general terms and conditions with regard to the
consequences of use of such information. NXP Semiconductors takes no
purchase of NXP Semiconductors products by customer.
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors. No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
All information provided in this document is subject to legal disclaimers. Product data sheet 3 January 2014 NXP Semiconductors BYC8X-600P Hyperfast power diode
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor
tested in accordance with automotive testing or application requirements.
NXP Semiconductors accepts no liability for inclusion and/or use of non-
automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards,
customer (a) shall use the product without NXP Semiconductors’ warranty
of the product for such automotive applications, use and specifications, and
(b) whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions. 13.4 Trademarks
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners. Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV, FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET, TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V. HD Radio and HD Radio logo — are trademarks of iBiquity Digital
All information provided in this document is subject to legal disclaimers. Product data sheet 3 January 2014 NXP Semiconductors BYC8X-600P Hyperfast power diode 14. Contents 1 NXP N.V. 2014. All rights reserved For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]Date of release: 3 January 2014
All information provided in this document is subject to legal disclaimers. Product data sheet 3 January 2014
http://npaper-wehaa.com/run/npaper?paper=nypress&get=print&pid=11270&id=1192551 Remedies for Sleep Problems nypress Tue, 03-08-2011 Ambien, melatonin, Benadryl or behavior therapy? By Herpreet Kaur Grewal If New York is “the city that never sleeps,” then between its late-night partygoers and workaholics, it may need a little extra advice on how to get some quality shuteye.
Fluconazole* (Diflucan) GENERIC DRUGS Itraconazole* (Sporanox) Ascension Health endorses the use of FDA Ketoconazole* (Nizoral) Nystatin* (Mycostatin) encourages the prescribing and dispensing of Terbinafine* (Lamisil) (QL) these generic medications whenever medically ANTI-MALARIALS ____________________________ Chloroquine* (Aralen) EXCLUDED DRUGS Hydroxycc